Our laboratory is aiming to develop reliable bonding materials and processes for advanced fine-pitch semiconductor/electronics packaging and EV/HEV power module packaging applications. We are currently interested in various low- and high-temperature endurable bonding materials (Sn, Cu, Ag, Au base alloys, preforms and pastes) and surface finishes (Cu, Ni, Pd, Au, and etc). We are also trying to develop various advanced electronics systems such as mobile/wearable electronics, car electronics, power conversion modules, and renewable energy modules.