Subject

• Undergraduate: Physics of Materials, Metallic Materials, Joining Engineering, Semiconductor Packaging Experiment

• Graduate: ICT Electronic Packaging, Reliability of Advanced Electronic Package

Research

• - Semiconductor/Electronic Packaging (Material/Process/Reliability)

• - Material/Component/Packaging in Car electronics for Future Automobile Applications

• - Material/Process/Reliability in Power Conversion Modules for EV/HEV Applications

• - Development of High-temperature endurable bonding materials (Cu, Ag, Au base alloys, preforms and pastes)

• - Surface treatments and bonding technology for functional electronic components and substrates

• - Advanced joining technology with high-density energy such as laser, ultrasonic, and light

Career

• [Education]

• -Ph.D, Sungkyunkwan University, Materials Science and Engineering

• -M.S, Sungkyunkwan University, Materials Science and Engineering

• -B.S, Sungkyunkwan University, Metallurgical Engineering

• [Career]

• -Chungbuk National University, Dept. of Advanced Materials Engineering, Associate Professor (2024.03~현재)

• -Chungbuk National University, Dept. of Advanced Materials Engineering, Assistant Professor (2020.03~2024.02)

• -Korea Institute of Industrial Technology, Senior/Principle Researcher (2014.08~2020.02)

• -Samsung Electronics, LSI Division, Senior Researcher (2013.10~2014.07)

• -Samsung Advanced Institute of Technology (SAIT), Research Staff (2011.08~2013.09)

• [Awards]

• -Who’s Who in the World, Marquis Who’s Who (2011~2020)

• -Top 100 Scientists, International Biographical Association (IBA) (2011)

• -Albert Nelson Marquis Lifetime Achievement Award, Marquis Who’s Who (2017~2018)

• -Best Paper Award, The Korean Welding and Joining Society, (2018)

• -29th Best Paper Award of Korean Science and Technology, The Korean Federation of Science and Technology (2019)

• -12th Haedong Academic Award (Haedong Young Scientist Award), Haedong Science Foundation (2021)

Thesis

• 1. Dong-Hwan Lee, Min-Seong Jeong and Jeong-Won Yoon, Comparative study of laser- and reflow-soldered Sn–3.0Ag–0.5Cu joints on thin-Au/Pd/Ni(P) substrate, Journal of Materials Science: Materials in Electronics, 34(3) (2023) 157

• 2. Hyeon-Tae Kim and Jeong-Won Yoon, Microstructures and mechanical properties of ENIG/Sn-3.5Ag/ENIG joints formed by ultrasonic-assisted solder bonding, Journal of Materials Research and Technology, 24 (2023) 4468-4483

• 3. Min-Haeng Heo, Young-Jin Seo and Jeong-Won Yoon, Novel and fast transient liquid phase bonding using etched Cu foam/Sn–3.0Ag–0.5Cu composite solder preform, Materials Today Communications, 35 (2023) 105730

• 4. Young-Jin Seo, Min-Haeng Heo, Eun-Chae Noh and Jeong-Won Yoon, Comparative study of solder size and volume effect on properties of Sn-3.0Ag-0.5Cu joints during isothermal aging, Journal of Materials Science: Materials in Electronics, 34(16) (2023) 1318

• 5. Min-Seong Jeong, Min-Haeng Heo, Jungsoo Kim and Jeong-Won Yoon, A comparative study of laser soldering and reflow soldering using Sn–58Bi solder/Cu joints, Journal of Materials Science: Materials in Electronics, 34(28) (2023) 1960

• 6. Hyeon-Tae Kim and Jeong-Won Yoon, Microstructures and mechanical properties of ultrasonic-welded Cu–Cu joints for power module terminals in electric vehicles, Journal of Materials Science: Materials in Electronics, 34(29) (2023) 1997

• 7. Min-Haeng Heo, Young-Jin Seo and Jeong-Won Yoon, Transient liquid phase bonding using Cu foam and Cu–Sn paste for high temperature applications, Journal of Materials Research and Technology, 27 (2023) 2856-2867

• 8. Eun-Chae Noh, Young-Jin Seo and Jeong-Won Yoon, Effects of solder ball size and reflow cycles on properties of Sn-3.0Ag-0.5Cu/Cu joints, Journal of Materials Science: Materials in Electronics, 34(33) (2023) 2176

• 9. So-Eun Jeong, Seung-Boo Jung and Jeong-Won Yoon, High-temperature stability of Ni-Sn intermetallic joints for power device packaging, Journal of Alloys and Compounds, 890 (2022) 161778

• 10. Jeong-Won Yoon and Jong-Hoon Back, Metallurgically and mechanically reliable microsilver sintered joints for automotive power module applications, Journal of Materials Science: Materials in Electronics, 33(3) (2022) 1724-1737

• 11. So-Eun Jeong and Jeong-Won Yoon, Intermetallic compound transformation and mechanical strength of Ni-Sn transient liquid phase sinter-bonded joints in an extreme high-temperature environment, Journal of Materials Science: Materials in Electronics, 33(9) (2022) 6616-6626

• 12. Dong-Hwan Lee, Min-Seong Jeong and Jeong-Won Yoon, Comparative study of interfacial reaction and bonding property of laser- and reflow-soldered Sn-Ag-Cu/Cu joints, Journal of Materials Science: Materials in Electronics, 33(10) (2022) 7983-7994

• 13. Min-Seong Jeong, Dong-Hwan Lee and Jeong-Won Yoon, Effect of temperature on shear properties of Sn-3.0Ag-0.5Cu and Sn-58Bi solder joints, Journal of Alloys and Compounds, 903 (2022) 163987

• 14. Min-Haeng Heo, Dong-Hwan Lee, Min-Seong Jeong and Jeong-Won Yoon, Effects of shear test temperatures and conditions on mechanical properties of Sn-Ag flip-chip bump, Journal of Materials Science: Materials in Electronics, 33(13) (2022) 10002-10012

• 15. Young-Jin Seo and Jeong-Won Yoon, Effects of solder volume and size on microstructures and mechanical properties of Sn-3.0Ag-0.5Cu solder joints, Journal of Materials Science: Materials in Electronics, 33(20) (2022) 16700-16709

• 16. Min-Seong Jeong, Dong-Hwan Lee, Hyeon-Tae Kim and Jeong-Won Yoon, Reliability of laser soldering using low melting temperature eutectic Sn-Bi solder and electroless Ni-electroless Pd-immersion Au-finished Cu pad, Materials Characterization, 194(2022) 112397

• 17. Jungsoo Kim, Seung-Boo Jung and Jeong-Won Yoon, Effect of Ni(P) thickness in Au/Pd/Ni(P) surface finish on the electrical reliabilityof Sn–3.0Ag–0.5Cu solder joints during current-stressing, Journal of Alloys and Compounds, 850 (2021) 156729

• 18. Jong-Hoon Back and Jeong-Won Yoon, Comparative study of normal and thin Au/Pd/Ni(P) surface finishes with Sn-3.0Ag-0.5Cu solder joints under isothermal aging, Journal of Materials Science: Materials in Electronics, 32(20) (2021) 24790-24800

• 19. Jungsoo Kim, Seung-Boo Jung, Jeong-Won Yoon, Effects of crystalline and amorphous Pd layers on initial interfacial reactions at Sn-3.0Ag-0.5Cu/thin-Au/Pd/Ni(P) solder joints, Applied Surface Science, 503 (2020) 144339

• 20. Jungsoo Kim, Jong-Hoon Back, Seung-Boo Jung, Jeong-Won Yoon, Interfacial reactions and mechanical properties of Sn–3.0Ag–0.5Cu solder with pure Pd or Pd(P) layers containing thin‑Au/Pd/Ni(P) surface‑finished PCBs during aging, Journal of Materials Science: Materials in Electronics, 31(5) (2020) 4027-4039

• 21. So-Eun Jeong, Seung-Boo Jung, Jeong-Won Yoon, Fast formation of Cu-Sn intermetallic joints using pre-annealed Sn/Cu/Sn composite preform for high-temperature bonding applications, Thin Solid Films, 698 (2020) 137873

• 22. Jungsoo Kim, Seung-Boo Jung, Jeong-Won Yoon, Effects of a phosphorous-containing Pd layer in a thin-ENEPIG surface finish on the interfacial reactions and mechanical strength of a Sn–58Bi solder joint, Journal of Alloys and Compounds, 820 (2020) 153396

• 23. Jeong-Won Yoon, Soyoung Bae, Byung-Suk Lee, Seung-Boo Jung, Bonding of power device to ceramic substrate using Sn-coated Cu micro paste for high-temperature applications, Applied Surface Science, 515 (2020) 146060

• 24. Jungsoo Kim, Jong-Hoon Back, Seung-Boo Jung, Jeong-Won Yoon, Effects of Ni layer thickness of thin-ENEPIG surface finishes on interfacial reactions and shear strength of Sn-3.0Ag-0.5Cu solder joints during aging, Journal of Materials Science: Materials in Electronics, 30 (2019) 12911-12923

• 25. Jungsoo Kim, Seung-Boo Jung, Jeong-Won Yoon, Optimal Ni(P) thickness and reliability evaluation of thin-Au/Pd(P)/Ni(P) surface-finish with Sn-3.0Ag-0.5Cu solder joints, Journal of Alloys and Compounds, 805 (2019) 1013-1024

• 26. Jeong-Won Yoon, Young-Se Kim, So-Eun Jeong, Nickel–tin transient liquid phase sintering with high bonding strength for high‑temperature power applications, Journal of Materials Science: Materials in Electronics, 30 (2019) 20205-20212

• 152 SCI(E) Papers, 34 KCI Papers, 14 US/Korean Patents